In order to deal with shrinking geometries, obtain higher yields and achieve lower cost to market, the analysis of bumps or solder balls is of great importance in the modern flip chip, BGA or µBGA manufacturing process.
	Measurement tasks include:
	Height Form Position Warpage Diameter	Coplanarity Presence Control Pitch Validation Matrix Error Stress/Deformation
	The ideal systems for BGA, Flip Chip, CSP and Bump measurement are the ScanView, the AutoScan and the LaserScan.
	Contact us for detailed product information.

BGA Measurement

Ball Grid Arrays	Vision System to Determine Ball Position, Pitch, Matrix Error & Diameter	Topographical Representation of Ball Height	Topographical Representation of Relative Height with Reference to The Seating Plane & Ball Coplanarity

Flip Chip Measurement

Mounted Flip Chip	3D Profile of Mounted Flip Chip	3D Image of Surface Determines The Warpage to be 13.6 µm	Height Determination via 2D Line

CSP Measurement

3D Image of Height and Coplanarity	Bump Position, Pitch, Matrix Error & Diameter Visual	Height Distribution of 48 Bumps	Topographical Representation of Relative Height & Coplanarity

Bump Measurement

Bumps on Dice (or Wafers)	Height 3D Profile	Height and Quantity Profile