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Thick
film printing is one of the first important steps in hybrid production.
To guarantee a successful manufacturing process, highly accurate measurements
of production parameters such as substrate roughness, conductance
path width, alterations in layer thickness, through contacts, trim
sections, soldering paste and glue drops are important. UBM systems'
non-contact measuring method can check the height of thick film components
at any (pre-taught) location immediately after the printing process.
A fast feedback to misaligned screen-printing machines or wrong printing
or paste parameters is thereby ensured. |
