BGA Measurement with the UBM ScanView

Prices for 2D option start at $ 55.000 Fast BGA/Flip Chip inspection combining vision and laser technologies Real time data capture allows 2D package inspection in less than 20 ms Confocal laser produces z axis measurement better than 1 µm Customizable GUI facilitates user definable operator interface

The ScanView is a modular BGA/Flip Chip inspection tool. The system is designed to meet the growing needs of quality and process control in IC packaging. Included in the standard system design is a suite of functions targeted at the specific needs of JEDEC tray, waffle pack, CSP and wafer level inspection. The heart of the ScanView is the coupling of a high throughput vision system with a sub-micron resolution laser; revolutionary in design and concept it boasts both high accuracy and near real time vision capture.

Customer Applications:

BGA measurements include:

• Ball Height measurement determines height above the substrate
  as well as relative ball height.
• Ball Placement verifies the location and the presence/absence of balls.
• Ball Size determines diameter and circularity.
• Coplanarity based on regression and-or seating plane method.
• Substrate Warpage for stress and bonding analysis.

209 K	For more information on the ScanView, please download our datasheet.

3D Profile of Bumps		Gold Bumps
Topographical & 2D Representation of Bump Diameter		Automated Data Analysis of BGA Package

For additional information or a free sample measurement report, please contact us directly.